Abstract: A bulk micromachined relay with lateral contact and isolation structure is presented. The relay is fabricated with glass/silicon wafer bonding and deep reactive ion etching (DRIE) process. Refilled polysilicon trenches are used as isolation structure. It is laterally driven with electrostatic actuator. The threshold voltage of the relay is simulated using Reduced Order Modeling (ROM) methods provided by a general finite element simulator, ANSYS^TM. The simulated result and experimental result are compared and discussed.

Key words: microelectromechanical system (MEMS), microrelay, finite element analysis(FEA), coupled analysis, reduced order modeling(ROM)

摘要： 介绍了一种横向接触式体硅微机械继电器。这种继电器采用硅/玻璃键合及深刻蚀(DRIE)工艺加工，并利用多晶硅填槽形成隔离结构。继电器采用静电激励，横向驱动。分析了继电器静电激励的阈值电压，介绍了一种在有限元仿真工具ANSYS^TM下用降解模型(ROM)分析阈值电压的方法，并对仿真结果和实验结果进行了比较和讨论。

关键词: 微机电系统, 微型继电器, 有限元仿真, 耦合分析, 降解模型