Acta Scientiarum Naturalium Universitatis Pekinensis ›› 2021, Vol. 57 ›› Issue (5): 823-832.DOI: 10.13209/j.0479-8023.2021.023

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Floor Plan Arrangement Based on Wafer-To-Wafer Bond Product

YIN Zhuo1,2,†, SU Yueyang2, LUO Daiyan3, MA Ying2, WANG Gang3, ZHU Na2, LIU Lifeng1, WU Hanming4, ZHANG Xing1,†#br#   

  1. 1. School of Software and Microelectronic, Peking University, Beijing 102600 2. Semiconductor Manufactory International Corporation (SMIC), Beijing 100176 3. Semiconductor Manufactory International Corporation (SMIC), Shanghai 201203 4. School of Microelectronics, Zhejiang University, Hangzhou 310058
  • Received:2020-08-14 Revised:2021-01-25 Online:2021-09-20 Published:2021-09-20
  • Contact: YIN Zhuo, E-mail: enjoy_dr(at)pku.edu.cn; ZHANG Xing, E-mail: zhx(at)pku.edu.cn

基于晶圆键合工艺的光刻掩膜版排版方法

尹卓1,2,†, 苏悦阳2, 罗代艳3, 马莹2, 王刚3, 朱娜2, 刘力锋1, 吴汉明4, 张兴1,†   

  1. 1. 北京大学软件与微电子学院, 北京 102600 2. 中芯国际集成电路制造(北京)有限公司, 北京 100176 3. 中芯国际集成电路制造(上海)有限公司, 上海 201203 4. 浙江大学微纳电子学院, 杭州 310058
  • 通讯作者: 尹卓, E-mail: enjoy_dr(at)pku.edu.cn; 张兴, E-mail: zhx(at)pku.edu.cn

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Abstract:

Wafer-to-wafer bond technology has breakthrough semiconductor manufacturing from 2D to 3D, but the bonded wafer brings more locating and patterning rules, it is too complex to layout the frame cells by traditional floor plan arrangement. This article provides a new floor plan arrangement method in face-to-face bonding product. It could setup all floor plans at same time only by flipping the motherboard. The new method is introduced. Final result with new method’s benefit is shown based on actually bonding product taping out procedure.

Key words: wafer-to-wafer bond, floor plan arrangement, 3D-IC

摘要：

晶圆–晶圆键合技术突破了传统晶圆平面工艺, 但键合晶圆的光刻对准图形及其他辅助图形有特殊的位置摆放和形貌绘制要求, 而传统方法进行光刻掩膜版排版费时费力且极易出错。针对该技术挑战, 提出一种与传统排版方式不同的整体翻转式排版方法: 在面对面晶圆–晶圆(两片)产品排版中, 通过“替换–翻转”过程, 可以快速有效地一次性解决辅助图形单元形貌和位置的对应翻转, 大幅度减少键合产品排版的工作量, 降低错误率, 有效地缩短产品导入时间周期。

关键词: 晶圆键合, 光刻掩膜版排版, 3D-IC 

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