Abstract: A built-in-self-test (BIST) & built-in-self-repair (BISR) scheme for detecting and repairing defective TSVs are proposed. The BIST circuit tests the TSVs, then the BISR circuit configures the TSV mapping logic according to the test result. The faulty TSV will be repaired by BISR circuit using TSV redundancy. The proposed design reduces the cost of TSV test, as well as mitigates the yield loss caused by TSV defects. Circuit simulations show that the area overhead and time overhead are acceptable.

Key words: 3D IC, TSV, BIST, BISR, redundancy

摘要： 提出一种检测和修复有缺陷TSV的内建自测试(BIST)和内建自修复(BISR)的方法。采用BIST电路测试TSV, 根据测试结构, 采用BISR电路配置TSV映射逻辑, 有故障的TSV可被BISR电路采用TSV冗余修复。所提出的设计可减小TSV测试价格, 并减少TSV缺陷引起的成品率损失。电路模拟表明, 面积代价和时间代价是可接受的。

关键词: 三维集成电路, 硅通孔, 内建自测试, 内建自修复, 冗余