Abstract: The interficial behavior between aluminum and Sn and its alloys during soldering has been studied by metallograph, SEM and microprobe methods. The results indicated that some needle-like crystals of Al-Sn-Zn solid solution at some points on aluminum were produced and pricked into alloy after intereaction between Al and Sn-Zn or Pb-Sn-Zn. Some alloys moistened on the surface of Al well and reacted with Al efficiently during soldering.

Key words: Moisten, soldering material, Sn and its alloys

摘要： 用显微结构方法研究了Sn及合金在一定的钎剂作用下与Al的相互作用。用扫描电镜及X射线能谱分析研究了锡及其7种锡合金钎料与Al的相互作用。Sn-Zn、Pb-Sn-Zn与Al相互作用后，在Sn合金层内和作用界面上有针状固溶体相生成。部分Sn合金在合适的钎剂作用下与Al有较好的润湿效果和界面反应。

关键词: 润湿, 钎料, 锡合金